100% foundry compatible packaging and full wafer release and die separation technique for surface micromachined devices
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100% foundry compatible packaging and full wafer release and die separation technique for surface micromachined devices, article, April 6, 2000; Albuquerque, New Mexico. (https://digital.library.unt.edu/ark:/67531/metadc706080/: accessed May 29, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.