Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies

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Heat removal for power semiconductor devices is critical for robust operation. Because there are different packaging options, different thermal management technologies, and a range of applications, there is a need for a methodology to match cooling technologies and package configurations to target applications. To meet this need, a methodology was developed to compare the sensitivity of cooling technologies on the overall package thermal performance over a range of power semiconductor packaging configurations. The results provide insight into the trade-offs associated with cooling technologies and package configurations. The approach provides a method for comparing new developments in power semiconductor packages and … continued below

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26 pp.

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Bennion, K. & Moreno, G. April 27, 2010.

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This presentation is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by the UNT Libraries Government Documents Department to the UNT Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 254 times. More information about this presentation can be viewed below.

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Heat removal for power semiconductor devices is critical for robust operation. Because there are different packaging options, different thermal management technologies, and a range of applications, there is a need for a methodology to match cooling technologies and package configurations to target applications. To meet this need, a methodology was developed to compare the sensitivity of cooling technologies on the overall package thermal performance over a range of power semiconductor packaging configurations. The results provide insight into the trade-offs associated with cooling technologies and package configurations. The approach provides a method for comparing new developments in power semiconductor packages and identifying potential thermal control technologies for the package. The results can help users select the appropriate combination of packaging configuration and cooling technology for the desired application.

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26 pp.

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  • Presented at the IMAPS 2nd Advanced Technology Workshop on Automotive Microelectronics and Packaging, 27-28 April 2010, Dearborn, Michigan

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  • Report No.: NREL/PR-540-48147
  • Grant Number: AC36-08GO28308
  • Office of Scientific & Technical Information Report Number: 983418
  • Archival Resource Key: ark:/67531/metadc1014983

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  • April 27, 2010

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  • Oct. 14, 2017, 8:36 a.m.

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  • Feb. 4, 2019, 6:24 p.m.

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Bennion, K. & Moreno, G. Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies, presentation, April 27, 2010; Golden, Colorado. (https://digital.library.unt.edu/ark:/67531/metadc1014983/: accessed June 2, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.

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