Logistics for the implementation of lead-free solders on electronic assemblies
Description:
The prospects of legislative and regulatory action aimed at taxing, restricting or banning lead-bearing materials from manufactured products has prompted the electronics community to examine the implementation of lead-free solders to replace currently used lead-containing alloys in the manufacture of electronic devices and assemblies. The logistics for changing the well established ``tin-lead solder technology`` require not only the selection of new compositions but also the qualification of di…
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Date:
December 31, 1993
Creator:
Vianco, P. T. & Artaki, I.
Item Type:
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Partner:
UNT Libraries Government Documents Department