A microstructural study of creep and thermal fatigue deformation in 60Sn-40Pb solder joints
Description:
Thermal fatigue failures of solder joints in electronic devices often arise from cyclic shear strains imposed by the mismatched thermal expansion coefficients of the materials that bind the joint as temperature changes are encountered. Increased solder joint reliability demands a fundamental understanding of the metallurigical mechanisms that control the fatigue to design accurate accelerated probative tests and new, more fatigue resistant solder alloys. The high temperatures and slow strain ra…
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Date:
June 2, 1990
Creator:
Tribula, D.
Item Type:
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Partner:
UNT Libraries Government Documents Department