Interfacial and near interfacial crack growth phenomena in metal bonded alumina
Description:
Metal/ceramic interfaces can be found in many engineering applications including microelectronic packaging, multi-layered films, coatings, joints, and composite materials. In order to design reliable engineering systems that contain metal/ceramic interfaces, a comprehensive understanding of interfacial and near interfacial failure mechanisms is necessary.
Date:
March 1, 2002
Creator:
Kruzic, Jamie Joseph
Partner:
UNT Libraries Government Documents Department