The Effect of Plasma on Silicon Nitride, Oxynitride and Other Metals for Enhanced Epoxy Adhesion for Packaging Applications
Description:
The effects of direct plasma chemistries on carbon removal from silicon nitride (SiNx) and oxynitride (SiOxNy ) surfaces and Cu have been studied by x-photoelectron spectroscopy (XPS) and ex-situ contact angle measurements. The data indicate that O2,NH3 and He capacitively coupled plasmas are effective at removing adventitious carbon from silicon nitride (SiNx) and Silicon oxynitride (SiOxNy ) surfaces. O2plasma and He plasma treatment results in the formation of silica overlayer. In contrast,…
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Date:
August 2014
Creator:
Gaddam, Sneha Sen
Partner:
UNT Libraries